| Date | Workshop Theme |
|---|---|
| June 2 (Mon.), 2025 / 09:00-16:25 | Evolution of Semiconductor Interconnect Technology and Future of AI and Quantum Computing |
Workshop Speakers
Platform and Device for Co-packaged Optics
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Prof. Yung-Jr Hung
National Sun Yat-sen University, Taiwan
BSPDN: An Interconnect Breakthrough Powered by Bonding Technology
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Dr. Kimin Jun
Samsung Electronics Co., Ltd., Korea
Building a Quantum Computer - from Device to System
-
Dr. Shu-Jen Han
SEEQC, USA
Semiconductor technology trends to overcome the integration limitations for future AI memory devices
-
Dr. Jiho Kang
SK hynix, Korea
The future system prospects of electrical and optical interconnects and their role in AI data centers
-
Prof. Jyehong Chen
National Yang Ming Chiao Tung University, Taiwan
Advanced 3DIC/TSV technologies for neuron machine interface devices
-
Prof. Tetsu Tanaka
Tohoku University, Japan
